Analysis of Correlation between Pad Temperature and Asperity Angle in Chemical Mechanical Planarization

A flexible nanobrush pad for the chemical mechanical planarization of Cu/ultra-low-к materials

A new idea of polishing pad called flexible nanobrush pad (FNP) has been proposed for the low down pressure chemical mechanical planarization (CMP) process of Cu/ultra-low-к materials. The FNP was designed with a surface layer of flexible brush-like nanofibers which can 'actively' carry nanoscale abrasives in slurry independent of the down pressure. Better planarization performances including h...

Yield improvement of chemical mechanical planarization processes

Eamkajornsiri, Sutee, "Yield improvement of chemical mechanical planarization processes " (2005). Retrospective Theses and Dissertations. Paper 3043. The quality of this reproduction is dependent upon the quality of the copy submitted. Broken or indistinct print, colored or poor quality illustrations and photographs, print bleed-through, substandard margins, and improper alignment can adversely...

Damascene Process and Chemical Mechanical Planarization )e

The constant demand to scale down transistors and improve device performance has led to material as well as process changes in the formation of IC interconnect. Traditionally, aluminum has been used to form the IC interconnects. The process involved subtractive etching of blanket aluminum as defined by the patterned photo resist. However, the scaling and performance demands have led to transiti...

Damascene Process and Chemical Mechanical Planarization

Laser Assisted Chemical Mechanical Polishing for Planarization